印刷及柔性电子 Reports and Subscriptions

The report assesses the market for eight different conductive ink types across 15 applications. Based on primary research and interviews with over 30 companies, it outlines technical developments and benchmarks ink properties across flake-based silver, nanoparticle-based silver, copper, stretchable/thermoformable, particle-free conductive inks and more. Application opportunities are evaluated, and their associated conductive ink requirements, including photovoltaics, multiple types of printed sensors, hybrid and in-mold electronics, and RFID/smart packaging.

IDTechEx的这份报告旨在评估那些能够使集成电子取代PCB的竞争性技术。它涵盖在3D表面添加电子的新技术（LDS、气溶胶技术、阀门喷射/分配技术、LIFT工艺和新兴技术）、模内电子（IME）和3D全打印电子技术、材料和应用。此外，报告还提供了29条市场预测线，介绍了30多家相关企业，并对它们的准备水平进行了评估，深入剖析了当前面临的技术挑战与潜在机遇。通过这份报告，我们可以对新兴的3D/增材电子领域获得清晰而深入的了解。

本报告描述了印刷和柔性传感器市场、技术和参与者，并探索了八大印刷传感器技术的最新技术革新，对每种技术进行了丰富的应用案例研究。同时，本报告对成熟市场和新兴市场进行了全面评估，包括从2024年到2034年的十年印刷传感器市场预测。此外，本报告还揭示了一个重要机遇——到2034年，印刷和柔性传感器市场的总规模预计将超过9.6亿美元。

《柔性混合电子元件 2024 - 2034》评估该新兴制造方法的现状和前景，该方法旨在将印刷电子和传统电子的优势结合起来。柔性混合电子元件 (FHE) 通常被描述为“印刷你能做到的，安置你无法做到的”，它有数字增材电子制造的优势，而不会影响集成电路的处理能力。根据多年来对印刷电子行业的跟踪和 40 次访谈，本报告概述了生产 FHE 电路所需的材料、组件和制造方法的趋势和创新。

智能包装有望将电子功能集成到日常产品中，实现状态监控、资产跟踪、消费者参与等。IDTechEx 报告对该新兴行业进行了深入的技术和市场评估，采访了 20 多家行业参与者，包括快速消费品 (FMCG) 企业。  根据公正的分析，IDTechEx 得出结论，根据包装中电子硬件的价值，到 2033 年，全球对电子智能包装的需求将达到 26 亿美元 - 如果还包括基础设施、软件和服务，则更多。

《模内电子组件 2023-2033》分析了与这种新兴制造方法相关的技术和市场机会。本报告参考了 20 多家公司的概况，其中大部分基于访谈，评估了与 IME 相关的（如功能性薄膜粘结）技术流程、材料要求、应用领域和竞争方法。报告包含技术和应用领域的 10 年市场预测，以收入和 IME 面板面积表示。对于最大的汽车内饰目标市场，这些人机界面 (HMI) 预测分为机械和四种不同类型的电容开关。

“制造印刷电子产品 2023 - 2033”探讨印刷电子设备市场的发展、过渡和技术创新。我们根据与 30 多家公司的采访和互动，评估适用于印刷电子产品的 20 种模拟/数字印刷和组件连接技术的属性、准备度、使用实例和市场需求，包括传统丝网印刷，以及激光诱导前向转移和光子焊接。

此报告讲述电子皮肤贴片市场、技术和参与者。涉及 13 个子皮肤贴片应用领域，包含 2010 - 2022 历史市场数据和 2023 - 2033 市场预测，是针对该产品领域编制的最全面的研究。它揭示了巨大的机遇，预计到 2033 年，电子皮肤贴片市场将增长到 270 亿美元以上。

Extensive opportunities for printed and flexible electronics are being created by the transition to electric and autonomous vehicles - these technologies include EV powertrains, interior sensors and displays, and even exterior heating and lighting. This report outlines the current status and opportunities for printed/flexible electronics across 11 application areas, along with 10-year market forecasts by revenue and volume, multiple case studies and assessments of commercial and technological readiness.

Printed/flexible electronics, already seen in foldable smart phones, are forecast to be widely adopted in applications ranging from medical devices to smart packaging and from e-textiles to consumer products. This technological transition provides extensive opportunities for innovative materials, including amongst others novel OLED emitters, particle-free conductive inks and conductive adhesives. This IDTechEx report includes market forecasts, detailed company profiles based on interviews, case studies, and technological roadmaps spanning the full range of materials. Our comprehensive overview and analysis should enable readers to understand and take advantage of the opportunities presented by this transition to printed/flexible electronics.

IDTechEx has tracked the technology, player and market development of flexible, thin film and printed batteries since 2014. This report provides detailed technological analysis, market status introduction, market assessment, opportunity and barrier discussion, player activity tracking, and gives 10-year market forecast by technology and application.

This report covers the latest applications of flexible electronics in healthcare, including electronic skin patches, electronic textiles, electrochemical test strips and smart blister packs. With increasing decentralization in the healthcare system enabled by the digital health movement, flexible electronics is well positioned to provide comfortable and long-term remote patient monitoring solutions. Flexible electronics enable new form factors and new products in health monitoring, a significant market worth over $8.3 billion in 2030.

此报告为您提供了解可伸缩电子器件所需的一切。它针对这个多元化的新兴行业提供最全面最独到的见解，探讨了现有和/或正在开发的各种不同的可伸缩材料/组件，引用了 60 多种集成可伸缩电子器件的产品类型，涵盖 100 多家公司和 25 个研究机构的进展（包括针对 62 家公司的第一手初步研究），另外，还提供了按 14 个以上的材料/组件领域细分的十年市场预测。

IDTechEx 报告"电子元件电磁干扰屏蔽 2024-2034"探讨了保护敏感电子组件的竞争策略和材料。涵盖从板级到封装级屏蔽，以及从喷镀到喷涂/印刷的过渡。报告评估了参与者和机会，并预测了多个应用领域对 EMI 材料的需求。

IDTechEx 多年来一直在研究通信技术，我们刚刚发布了最新版本的 6G 市场研究报告“6G 市场 2023-2043：技术、趋势、预测、参与者”。此报告以我们的专业知识为基础，涵盖最新的 6G 技术发展趋势、关键应用、参与者活动和市场展望。本报告的重点方面包括太赫兹技术趋势、太赫兹通信半导体、太赫兹相控阵天线模块、6G 无线电分析、低损耗材料、6G 封装趋势、可重构智能表面 (RIS)、超材料、非地面网络、集成传感和通信、6G 市场以及未来展望。

机器人作为一种具有自主性的机器，需要一套传感器。本报告全面概述了机器人的先进传感技术和新兴趋势。报告提供了不同传感器的年度销量和市场规模粒度预测，细分为 29 种不同机器人/应用和传感器类型，详细阐明了哪些传感器和机器人应用在未来 20 年增长最快。

报告评估了电子制造的可持续方法。它评估了印刷电路板和集成电路内的可持续创新如何推动电子新时代的发展。报告包含精细的市场预测，涵盖不同的材料和制造工艺，并确保它们能以可扩展且具有成本效益的方式改善环境。IDTechEx 预计，在十年内，20% 的印刷电路板将可使用更加可持续的方法制造。

IDTechEx has been studying 5G-related topics for many years and we have just released our latest version of the 5G market research report "5G Market 2023-2033: Technology, Trends, Forecasts, Players". This report is built on IDTechEx expertise, covering the latest 5G development trend, key player analysis, and market outlook. Key aspects in this report include mmWave technologies trend, open radio access network (Open RAN) development, power management of 5G base stations, heterogeneous smart electromagnetic (EM) environment, detailed regional analysis of 5G status and future roadmap in 5 key regions: U.S., China, Japan, South Korea, Europe, and 5G applications (Industry 4.0, C-V2X, AR/VR, FWA etc) development status.

Wearable sensors are fundamental to continuous monitoring of health, fitness, and wellness. As applications for wearable technology grow, there are increasing opportunities for sensors that detect parameters ranging from glucose levels to pressure and from motion to temperature. Based on a decade of market research on wearable technology hardware, this report analyses the technological and commercial landscape of this growing industry, both today and into the future.

The future of solar technology extends far beyond silicon, with numerous alternative materials that belong to a certain class called 'thin film'. These can deliver several unique advantages such as higher efficiency indoor energy harvesting, simpler manufacturing, and potentially lower costs than conventional silicon PV. A particularly exciting opportunity is their role in powering Internet of Things devices - a rapidly growing market following the increasing smartification of home and retail electronics.

Perovskite photovoltaics have already demonstrated remarkable efficiencies, with new applications enabled by their low cost, thin film architecture and tuneable absorption. This IDTechEx report explores the suitability and market opportunities of perovskite PV as well as the innovation opportunities and barriers to entry. It evaluates methods to resolve the main challenge of stability, as well as manufacturing methods and requirements for speciality materials.

This report covers the entire landscape for diabetes management devices, including mature, emerging, and future options. We characterise and predict the technological landscape of the industry over the next decade. Strategies of major players in the industry are discussed and analysed. Developments of major milestones, such as the launch of closed-loop systems and non-invasive CGMs, are considered and discussed in our forecasts.

Point-of-care biosensors have been crucial in handling the COVID-19 pandemic, which has caused the market to more than double since 2019. In this report IDTechEx explores the drivers of the market's growth, key technologies enabling point-of-care testing, assesses emerging technologies bringing patient diagnosis ever closer to the point-of-care, and the opportunities and threats that these trends present.

Electrically conductive adhesive (ECAs) are a competitor to solder. ECAs are set to become a key conductive joining technology across several industries, such as flexible electronics, in-mold electronics, and wearable technologies. This report includes key insights and commercial outlooks for the global electrically conductive adhesive market. The report considers electrically conductive adhesives (ECAs), including isotropic conductive adhesives (ICAs), anisotropic conductive pastes (ACPs) and anisotropic conductive films (ACFs). 10-year ECA market forecasts are given for each application area.